Semicon 2.0 Draws Rs 1 Lakh Cr Investment Commitments
Semicon 2.0 draws Rs 1 lakh crore investment commitments as India expands semiconductor design, fabs, packaging, R&D and talent development across the ecosystem
India has received investment commitments of around Rs 1 lakh crore, or approximately USD 11–12 billion, under Semicon 2.0, as the government seeks to expand the country’s semiconductor ecosystem across design, manufacturing, equipment, advanced packaging, research and talent development.
Electronics and IT Minister Ashwini Vaishnaw said the commitments are expected to generate close to 1 lakh new employment opportunities across the semiconductor ecosystem. The investments are expected to materialise over the next two to three years, subject to the required board and shareholder approvals.
Speaking at SEMICON India 2026, Vaishnaw said Semicon 1.0 focused on establishing the foundation for India’s semiconductor industry, while Semicon 2.0 aims to build a broader ecosystem across the value chain.
The second phase will focus on six areas — semiconductor design, machines and materials, fabs, advanced packaging, research and development, and talent development.
Under the design pillar, the government is targeting 200 semiconductor design startups, compared with 105 startups supported during the first phase. Of these, 20 have already secured venture capital funding. The government also plans to help companies move from individual chip design towards systems design.
The programme will also seek to develop domestic capabilities in semiconductor manufacturing equipment, materials, gases, chemicals, precision manufacturing and supply chains. The government plans to support fabs across display, memory, silicon, compound and logic technologies, along with advanced packaging capabilities.
Semicon 2.0 will promote applied research involving industry, government and academic institutions. On talent, the government plans to train 1 lakh technicians over five years through partnerships with industry and international institutions, including Taiwan-based ITRI.
The government also announced 11 MoUs and five announcements at SEMICON India 2026 covering semiconductor manufacturing, packaging, materials, equipment, design and workforce development.
Key agreements include Tata Electronics’ partnerships with Nexperia for wafer manufacturing, assembly and testing, Ascendas First Space for a 363-acre vendor park in Dholera, Fujifilm and JSR for semiconductor materials, and BESI for advanced packaging.
India Semiconductor Mission and Intel India also launched an ‘Introduction to Semiconductors’ course, while six ChipIN regional centres were announced to expand access to semiconductor design capabilities.
Vaishnaw said the focus of Semicon 2.0 is to build a complete ecosystem around semiconductor manufacturing rather than individual facilities. SEMICON India 2026 is being held at Yashobhoomi in New Delhi until September 19, with more than 600 participating companies and representatives from 52 countries.