Get started
Microchip Technology Incorporated 1.625% 15-FEB-2027Microchip Technology Incorporated 1.625% 15-FEB-2027Microchip Technology Incorporated 1.625% 15-FEB-2027
BondBondBond

Microchip Technology Incorporated 1.625% 15-FEB-2027

No trades
No trades
OverviewProfile
Full chart
Full chart

Compare with Microchip Technology Incorporated 1.625% 15-FEB-2027



Key terms


Outstanding amount
‪37.91 M‬ USD
Face value
1,000.00 USD
Minimum denomination
1,000.00 USD
Coupon
1.63%
Coupon frequency
Semi-annual
Maturity date
Feb 15, 2027
Term to maturity
4 months

Bond info


Issuer
Microchip Technology, Inc.
Sector
Electronic Technology
Industry
Semiconductors
Home page
microchip.com
Issue date
Mar 13, 2018
ISIN
US595017AF11
CUSIP
595017AF1
FIGI
BBG00FYJCZD2
Identifiers
ISIN US595017AF11
CFI code
DCFOFR
Microchip Technology, Inc. engages in the provision of semiconductor products. It operates through the Semiconductor Products and Technology Licensing segments. The Semiconductor Products segment is involved in designing, developing, manufacturing, and marketing microcontrollers, development tools and analog, interface, mixed signal, connectivity devices, and timing products. The Technology Licensing segment offers license fees and royalties associated with technology licenses for the use of SuperFlash embedded flash and Smartbits one-time programmable technologies. The company was founded on February 14, 1989 and is headquartered in Chandler, AZ.

Profile


Sign up to see advanced bond data
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.