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GF SSE STAR Chip Design Thematic Index Exchange Traded Fund UnitsGF SSE STAR Chip Design Thematic Index Exchange Traded Fund UnitsGF SSE STAR Chip Design Thematic Index Exchange Traded Fund Units

GF SSE STAR Chip Design Thematic Index Exchange Traded Fund Units

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Fund composition


As of June 30, 2026
Symbol
Weight %
Shares
Market value
6
688525Biwin Storage Technology Co., Ltd. Class A
10.78%
‪‪161.13 K‬‬
‪‪79.72 M‬‬CNY
6
688041Hygon Information Technology Co., Ltd. Class A
9.93%
‪‪198.16 K‬‬
‪‪73.38 M‬‬CNY
6
688008Montage Technology Co., Ltd. Class A
9.60%
‪‪229.04 K‬‬
‪‪70.98 M‬‬CNY
6
688521VeriSilicon Microelectronics (Shanghai) Co., Ltd. Class A
9.02%
‪‪179.57 K‬‬
‪‪66.65 M‬‬CNY
6
688256Cambricon Technologies Corp. Ltd. Class A
8.80%
‪‪40.76 K‬‬
‪‪65.04 M‬‬CNY
6
688766Puya Semiconductor (Shanghai) Co. Ltd. Class A
4.62%
‪‪44.59 K‬‬
‪‪34.18 M‬‬CNY
6
688110Dosilicon Co. Ltd. Class A
3.65%
‪‪132.37 K‬‬
‪‪26.96 M‬‬CNY
6
688002Raytron Technology Co., Ltd. Class A
3.36%
‪‪160.50 K‬‬
‪‪24.83 M‬‬CNY
6
688702Suzhou Centec Communications Co., Ltd. Class A
2.80%
‪‪52.98 K‬‬
‪‪20.66 M‬‬CNY
6
688099Amlogic (Shanghai) Co., Ltd. Class A
2.51%
‪‪180.60 K‬‬
‪‪18.58 M‬‬CNY
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